86-15273293324        info@sunyinstrument.com

In-line 3D Solder Paste SPI Inspection Machine

Model: SUNY-Ultra
Maximum Loading PCB Size(X*Y): 480x490mm
Professional PCB making machine

TECHNICAL PARAMETERS:

Programmable phase contour modulation measurement techniques.

Defect Inspection:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component size: 008004.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).

Maximum Loading PCB Size(X*Y): 480x490mm.

Ultra-high frames and high precision industrial camera.

Linear encoder.

Professional of GPU image processing.

Inspection Speed: 0.35 SEC/FOV.

Fiducial mark Detection Time: 0.3sec/piece.

Maximum inspection height:±450um (±1200umOption).

High precision industrial camera with high frame count.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic and static warpage compensation.

Barcode function with traceability.

Badmark transfer function of placement machine.

Access IMS system functions.

Operating System Support: Windows 7 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.


INQUIRY

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