PCB Copper etching Plating machine

Specification
1. Usage: full automatic double-sided perforative aperture copper sinking to the double or multi-sided circuit board and other non-metal materials,
2. Working mode: full automatic electric level transmission, automatic inside board detection, constant temperature and heating temperature control of double temperature control protection, with immersion, water washing, activation and through aperture four full automatic working function districts, there is liquid isolation zone and sucked dry area between each function district, the whole process without human intervention, ensuring the copper sinking rate and processing efficiency,
3. Copper sinking technology: advanced black-aperture process, without environmental pollution;
4. Aperture-arranging district: level transmission high pressure perforative aperture and aperture-arranging function, automatic constant temperature and heating temperature function
5. Black aperture district: level transmission high pressure perforative aperture and aperture-arranging function, automatic constant temperature and heating temperature function
6. Through aperture district: high-pressure pump, level transmission, realizing automatic high pressure through aperture;
7. Gas flow: 48L/min;
8. Control system: high-performance ARM embedded processor + embedded operating system, human-computer interface: big screen color LCD screen + touch screen; In touch screen you can read electronic edition automatic copper sinking process manual; In touch screen you can play the video file of automatic copper sinking process;
9. Processing dimension: 600mm×500mm double-sided board;
10. Input power: AC380V/50Hz
11. Entire machine power: 10KW
12. Overall volume: length 3490mm×height 1380mm×width 1120mm;
13. Weight: 500Kg (liquid not contained).